Diamontronics led by HKU professor develops GaN-on-diamond wafer bonding tech for high-power chip cooling. Composed of seasoned university experts, they pilot production to serve 6G, AI and aerospace industries.
Wafer-level heat dissipation solution based on GaN-on-diamond bonding technology
Disclaimer: Any opinions, findings, conclusions or recommendations expressed in this material/event (or by members of the project team) do not reflect the views of the Government of the Hong Kong Special Administrative Region, the Innovation and Technology Commission or the General Support Programme Vetting Committee of the Innovation and Technology Fund.
© Designed by WHALE CASTLE IT CONSULTANT, Powered by MAGIC SQUARE STUDIO